Sid Deshpande is a Principal Electrical Design Engineer at FormFactor Inc., where he leverages his extensive expertise in high-speed and power circuit design to drive innovation in advanced electronic products. With six years of dedicated experience in the field, Sid has cultivated a robust understanding...
Sid Deshpande is a Principal Electrical Design Engineer at FormFactor Inc., where he leverages his extensive expertise in high-speed and power circuit design to drive innovation in advanced electronic products. With six years of dedicated experience in the field, Sid has cultivated a robust understanding of electrical engineering principles, enabling him to lead complex hardware projects from conception to completion. His current focus revolves around the design of Logic Probe card substrates, both organic and ceramic, where he excels in creating intricate netlists and meticulously planning BGA floor layouts.
Sid's proficiency in arranging 46-72 layer stack-ups is complemented by his adeptness in using Cadence APD V16.6 for layout reviews, ensuring that each design meets the highest standards of performance and reliability. His work on vertical probe cards showcases his ability to integrate cutting-edge technology with practical applications, enhancing the efficiency of testing processes in various sectors, including consumer electronics and electric vehicles.
A strong advocate for design automation, Sid is actively driving initiatives to fully automate design processes, which not only streamlines workflows but also significantly reduces time-to-market for new products. His skill set encompasses a wide array of competencies, including analog circuit design, printed circuit board (PCB) design, and high-speed digital design, making him a valuable asset to any project team. Additionally, his experience with test automation and troubleshooting further solidifies his role as a key contributor to FormFactor's mission of delivering high-quality test solutions that meet the evolving demands of the electronics industry.
