Rihua Wei currently serves as a Senior Principal Design Engineer at NXP Semiconductors, where he plays a pivotal role in the design and development of advanced 802.11 series modem technologies. His expertise in wireless communication systems, particularly in the 802.11g/n/ac/ax Wi-Fi PHY design, positions him...
Rihua Wei currently serves as a Senior Principal Design Engineer at NXP Semiconductors, where he plays a pivotal role in the design and development of advanced 802.11 series modem technologies. His expertise in wireless communication systems, particularly in the 802.11g/n/ac/ax Wi-Fi PHY design, positions him as a key contributor to NXP's innovative solutions in the semiconductor industry. Rihua's extensive experience encompasses a wide range of engineering skills, including Verilog and VHDL for ASIC and FPGA design, where he excels in Digital Signal Processing (DSP) modeling, system specification, architecture development, RTL coding, functional simulation, synthesis, and timing analysis.
At NXP, Rihua is actively involved in several high-impact projects that leverage his proficiency in SoC integration and PCB board design. His work not only focuses on the technical aspects of modem design but also emphasizes the importance of firmware development and algorithm optimization to enhance performance and efficiency. Rihua's adeptness in simulation tools and methodologies, including MATLAB and C programming, allows him to create robust designs that meet stringent industry standards.
Prior to his current role, Rihua conducted significant academic research on packet classification and classifier minimization, further enriching his analytical skills and understanding of complex data processing systems. His diverse skill set and commitment to excellence make him a valuable asset to NXP Semiconductors, where he continues to drive innovation in wireless communication technologies.
