Jason Zarghami serves as the Director of Engineering at Micron Technology, where he leverages over two decades of experience in the semiconductor industry to drive innovation and excellence in product development. His leadership is characterized by a positive, “can do” attitude, which fosters a collaborative...
Jason Zarghami serves as the Director of Engineering at Micron Technology, where he leverages over two decades of experience in the semiconductor industry to drive innovation and excellence in product development. His leadership is characterized by a positive, “can do” attitude, which fosters a collaborative environment among his team of design and product engineers. In his current role, Jason manages all high-volume manufacturing (HVM) activities for Flash products, ensuring that each project meets the rigorous standards of quality and performance that Micron is known for.
Under Jason's guidance, the engineering team is engaged in key projects that push the boundaries of Flash memory technology, including advancements in NAND and NOR architectures. His extensive knowledge of various semiconductor products, including programmable logic devices (PLD), CPUs, and chipsets, allows him to integrate diverse technologies seamlessly, enhancing product offerings and market competitiveness. Jason's expertise in project management and product development is instrumental in navigating the complexities of the semiconductor landscape, from initial concept through to market launch.
Additionally, Jason's proficiency in managing cross-functional teams and his strategic approach to product management ensure that Micron remains at the forefront of innovation in the memory sector. His commitment to continuous improvement and excellence in engineering not only drives successful project outcomes but also cultivates the next generation of leaders within the organization. As a result, Jason Zarghami is not just a key player in Micron's success; he is also a vital contributor to the evolution of semiconductor technology as a whole.
