Henry Sze serves as a Principal Packaging Engineer specializing in Module and System in Package (SiP) technologies at Analog Devices, where he leverages his extensive semiconductor packaging expertise to drive innovation and enhance product performance. With a strong foundation in semiconductor packaging design and advanced...
Henry Sze serves as a Principal Packaging Engineer specializing in Module and System in Package (SiP) technologies at Analog Devices, where he leverages his extensive semiconductor packaging expertise to drive innovation and enhance product performance. With a strong foundation in semiconductor packaging design and advanced technology development, Henry is at the forefront of creating cutting-edge packaging solutions that meet the rigorous demands of the electronics industry. His role involves leading key projects that focus on the integration of complex systems into compact form factors, ensuring optimal reliability and performance.
Henry's in-depth manufacturing experience encompasses all facets of package assembly, process monitoring, and control, allowing him to implement best practices that enhance yield and efficiency. His proficiency with various advanced packaging technologies, including flip-chip, ball grid array (BGA), and multi-chip modules, positions him as a vital contributor to cross-functional teams tasked with developing next-generation products. His detailed understanding of direct materials, particularly substrate materials, enables him to make informed decisions that influence both design and manufacturability.
In addition to his technical acumen, Henry excels in engineering management, guiding teams through the complexities of design of experiments (DOE) and debugging processes. His commitment to reliability and quality assurance ensures that the products developed under his leadership not only meet but exceed industry standards. As a thought leader in the semiconductor packaging domain, Henry continues to push the boundaries of what is possible, fostering innovation that drives the future of electronics.
