Helen Chung is an accomplished Advanced Electronics Packaging Principal Member of Technical Staff at Sandia National Laboratories, where she leverages her extensive expertise in semiconductor process integration and packaging technologies. With a robust background that includes significant contributions to the semiconductor industry at IBM, Helen...
Helen Chung is an accomplished Advanced Electronics Packaging Principal Member of Technical Staff at Sandia National Laboratories, where she leverages her extensive expertise in semiconductor process integration and packaging technologies. With a robust background that includes significant contributions to the semiconductor industry at IBM, Helen has honed her skills in advanced techniques such as Plasma-Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), and various physical vapor deposition (PVD) methods. Her deep understanding of etching, photolithography, and chemical mechanical polishing (CMP) positions her as a leading expert in the field.
At Sandia, Helen is at the forefront of innovative projects focused on 2.5D and 3D heterogeneous integration electronics packaging. She plays a pivotal role in developing cutting-edge solutions involving hybrid bonding, through-silicon vias (TSV), and wafer-level fan-out (WLFO) packaging. Her work on flip chip packaging utilizing plastic ball grid array (PBGA) technology showcases her ability to integrate complex systems while maintaining high performance and reliability.
In addition to her technical prowess, Helen is adept in thermal and thermo-mechanical simulations using COMSOL, allowing her to predict and mitigate potential challenges in power module and multi-chip module packaging. Her expertise extends to system-in-package (SiP) and system-on-chip (SoC) designs, where she collaborates with cross-functional teams to drive projects from conception to realization. With a Ph.D. in Materials Science and Engineering, Helen combines her strong program and project management skills with her technical knowledge, making her a key contributor to advancing semiconductor packaging technologies at Sandia National Laboratories.
