Brian Scholz serves as the Executive Design/Build Leader at HP Legacy, Inc., where he leverages over three decades of experience in the industrial and commercial construction markets to drive innovative projects that meet the diverse needs of clients across North and South America. Under his...
Brian Scholz serves as the Executive Design/Build Leader at HP Legacy, Inc., where he leverages over three decades of experience in the industrial and commercial construction markets to drive innovative projects that meet the diverse needs of clients across North and South America. Under his leadership, HP Legacy has successfully executed a wide array of design-build projects, ranging from energy-efficient solutions to large-scale commercial developments. His expertise in energy conservation and HVAC systems has been instrumental in delivering sustainable designs that not only enhance operational efficiency but also reduce environmental impact.
Brian's portfolio includes high-profile projects for industry giants such as Nestle, GE Gas Turbine, and BASF, where he has demonstrated a keen ability to manage complex project bidding processes and subcontracting arrangements. His commitment to value engineering ensures that clients receive optimal solutions that align with their budgetary and operational goals. Additionally, his strong background in facilities management and contract management allows him to maintain seamless communication with stakeholders, ensuring that projects are delivered on time and within scope.
A firm believer in building lasting relationships, Brian emphasizes the importance of customer service and transparency in all interactions. His strategic approach to project execution and his dedication to fostering trust have positioned HP Legacy as a preferred partner in the construction industry. As he continues to lead transformative projects, Brian remains focused on integrating innovative technologies and sustainable practices, further solidifying HP Legacy's reputation as a leader in the design-build sector.