Arun Somasundaram serves as the Principal Micro Assembly Process Engineer at FormFactor Inc., where he leverages his extensive expertise in MEMS packaging and advanced manufacturing processes to drive innovation and efficiency in semiconductor solutions. With a robust background in production lab environments, Arun has honed...
Arun Somasundaram serves as the Principal Micro Assembly Process Engineer at FormFactor Inc., where he leverages his extensive expertise in MEMS packaging and advanced manufacturing processes to drive innovation and efficiency in semiconductor solutions. With a robust background in production lab environments, Arun has honed his skills across various cutting-edge technologies, including Laser Powder Bed Fusion (LPBF) additive manufacturing, roll-to-roll (R2R) cold stamping, and powder isostatic pressing. His hands-on experience extends to critical processes such as sintering, PVD coating, heat treatment, and high-precision assembly, making him a pivotal figure in the development of next-generation microelectronic devices.
Arun's proficiency in materials characterization is equally impressive, encompassing techniques such as Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), Electron Backscatter Diffraction (EBSD), Transmission Electron Microscopy (TEM), X-ray Fluorescence (XRF), and X-ray Diffraction (XRD). His expertise in nano-mechanical testing and failure analysis allows him to conduct comprehensive data analysis, ensuring that product performance meets the stringent demands of the semiconductor industry.
At FormFactor, Arun is instrumental in leading key projects that focus on enhancing the reliability and scalability of MEMS packaging solutions. His leadership in process engineering and deep understanding of semiconductor processes enable him to collaborate effectively with cross-functional teams, driving research and engineering initiatives that align with the evolving needs of automotive and logic foundries. As a thought leader in materials science and electronics packaging, Arun continues to push the boundaries of innovation, positioning FormFactor at the forefront of the semiconductor landscape.
