Brian Franco is a dedicated ATTD Packaging R&D Engineer at Intel, where he leverages his extensive background in materials science to drive innovation in semiconductor packaging technologies. With a Ph.D. in Materials Science, Brian specializes in the intricate relationships between process, property, and microstructure, particularly...
Brian Franco is a dedicated ATTD Packaging R&D Engineer at Intel, where he leverages his extensive background in materials science to drive innovation in semiconductor packaging technologies. With a Ph.D. in Materials Science, Brian specializes in the intricate relationships between process, property, and microstructure, particularly in the realm of additive manufacturing and shape memory alloys. His current role involves spearheading technology development programs that not only enhance Intel's packaging capabilities but also foster collaboration with supplier partners to ensure high-confidence materials solutions.
One of Brian's key projects focuses on advancing second-level interconnect solder technologies. He is actively involved in developing low-temperature and medium-temperature solder metallurgies that significantly improve electromigration performance and reliability. This initiative is crucial as the semiconductor industry faces increasing performance demands and the need for sustainable practices, prompting Brian to explore recycled materials in solder formulations. His hands-on experimental approach is complemented by his expertise in materials testing, defect elimination, and process engineering, allowing him to design and maintain specialized laboratory equipment tailored for cutting-edge research.
Brian's proficiency in tools such as COMSOL and Matlab, alongside his experience with focused ion beam (FIB) techniques, positions him at the forefront of materials characterization and alloy development. His commitment to innovation and excellence not only drives his projects forward but also contributes to Intel's mission of delivering next-generation technology building blocks that meet the evolving needs of the industry.
