Ram Vadlamani serves as an R&D Packaging Engineer at Intel Corporation, specializing in advanced packaging solutions that cater to both Intel's product lines and external foundry customers. With a focus on wafer and substrate panel level assembly, Ram is at the forefront of integrating chiplets...
Ram Vadlamani serves as an R&D Packaging Engineer at Intel Corporation, specializing in advanced packaging solutions that cater to both Intel's product lines and external foundry customers. With a focus on wafer and substrate panel level assembly, Ram is at the forefront of integrating chiplets onto base wafers, a critical aspect of modern semiconductor manufacturing. His role as a Module Engineer in Wafer Level Assembly emphasizes the importance of thermal management and mechanical integrity in electronic packaging. He is particularly adept at thermo-compression bonding of dies on silicon interposers, where he applies his expertise in thermal and mechanical design to ensure optimal performance and reliability of electronic packages.
In addition to his technical prowess, Ram is an experienced project manager, overseeing the development and integration of new toolsets and packaging processes into factory environments. His ability to navigate complex projects from conception to execution is bolstered by his strong background in data analysis and experimental research, which he utilizes to drive innovation and efficiency in packaging engineering.
Ram's academic experience in preclinical translational studies and the development of pulsed power devices for biomedical applications enriches his approach to engineering challenges. His work on antibiotic-resistant bacteria and cancer ablation demonstrates a unique intersection of biotechnology and packaging engineering, highlighting his versatility and commitment to advancing technology across multiple domains. With skills ranging from 3D printing to nuclear engineering, Ram Vadlamani is not only a key player at Intel but also a thought leader in the evolving landscape of advanced packaging solutions.
